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? semiconductor components industries, llc, 2011 march, 2011 ? rev. 4 1 publication order number: cm1420/d cm1420, cm1422 lcd emi filter array with esd protection description the cm1420 and cm1422 are emi filter arrays with esd protection, which integrate six and eight pi ? filters (c ? r ? c), respectively. the cm1420/22 has component values of 15 pf ? 100 ? 15 pf. these devices include esd protection diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (esd). the esd diodes connected to the filter ports safely dissipate esd strikes of 15 kv, well beyond the maximum requirement of the iec 61000 ? 4 ? 2 international standard. using the mil ? std ? 883 (method 3015) specification for human body model (hbm) esd, the pins are protected for contact discharges at greater than 30 kv. this device is particularly well suited for portable electronics (e.g. wireless handsets, pdas, notebook computers) because of its small package format and easy ? to ? use pin assignments. in particular, the cm1420/22 is ideal for emi filtering and protecting data lines from esd for the lcd display in clamshell handsets. the cm1420 and cm1422 incorporate optiguard coating which results in improved reliability at assembly. the cm1420 and cm1422 are available in space ? saving, low ? profile chip scale packages with rohs compliant lead ? free finishing. features ? functionally and pin compatible with cspemi606 (cm1420) and cspemi608 (cm1422) devices ? optiguard coated for improved reliability at assembly ? six and eight channels of emi filtering ? 15 kv esd protection on each channel (iec 61000 ? 4 ? 2 level 4, contact discharge) ? 30 kv esd protection on each channel (hbm) ? better than 30 db of attenuation at 1 ghz to 3 ghz ? chip scale package features extremely low lead inductance for optimum filter and esd performance ? 15 ? bump, 2.960 mm x 1.330 mm footprint chip scale package (cm1420) ? 20 ? bump, 4.000 mm x 1.458 mm footprint chip scale package (cm1422) ? these devices are pb ? free and are rohs compliant applications ? lcd data lines in clamshell wireless handsets ? emi filtering & esd protection for high ? speed i/o data ports ? wireless handsets / cell phones ? notebook computers ? pdas / handheld pcs ? emi filtering for high ? speed data lines marking diagram device package shipping ? ordering information http://onsemi.com cm1420 ? 03cp csp ? 15 (pb ? free) 3500/tape & reel n203 = cm1420 ? 03cp n223 = cm1422 ? 03cp n203 cm1422 ? 03cp csp ? 20 (pb ? free) 3500/tape & reel cm1420 15 ? bump csp package n223 cm1422 20 ? bump csp package ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. wlcsp15 cp suffix case 567bs wlcsp20 cp suffix case 567bz
cm1420, cm1422 http://onsemi.com 2 block diagram filtern* gnd (pins b1 ? bn) *see package/pinout diagrams for expanded pin information. 100 filtern* 1 of n emi filtering + esd channels (n = 6 for cm1420, 8 for cm1422) 15 pf 15 pf package / pinout diagrams bottom view (bumps up view) top view (bumps down view) cm1422 csp package c1 c2 b1 a1 a2 a1 c3 c4 b2 a3 a4 orientation marking a orientation marking + b c 123 n223 567 48 c5 c6 b3 a5 a6 c7 c8 b4 a7 a8 cm1420 csp package c1 c2 b1 a1 a2 a1 c3 c4 b2 a3 a4 orientation marking a orientation marking + b c 123 n203 56 4 c5 c6 b3 a5 a6 table 1. pin descriptions cm1420 cm1422 name description cm1420 cm1422 name description pin(s) pin(s) pin(s) pin(s) a1 a1 filter1 filter channel 1 c1 c1 filter1 filter channel 1 a2 a2 filter2 filter channel 2 c2 c2 filter2 filter channel 2 a3 a3 filter3 filter channel 3 c3 c3 filter3 filter channel 3 a4 a4 filter4 filter channel 4 c4 c4 filter4 filter channel 4 a5 a5 filter5 filter channel 5 c5 c5 filter5 filter channel 5 a6 a6 filter6 filter channel 6 c6 c6 filter6 filter channel 6 ? a7 filter7 filter channel 7 ? c7 filter7 filter channel 7 ? a8 filter8 filter channel 8 ? c8 filter8 filter channel 8 b1 ? b3 b1 ? b4 gnd device ground
cm1420, cm1422 http://onsemi.com 3 specifications table 2. absolute maximum ratings parameter rating units storage temperature range ? 65 to +150 c dc power per resistor 100 mw dc package power rating 500 mw stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. table 3. standard operating conditions parameter rating units operating temperature range ? 40 to +85 c table 4. electrical operating characteristics (note 1) symbol parameter conditions min typ max units r resistance 80 100 120 c capacitance at 2.5 v dc, 1 mhz, 30 mv ac 12 15 18 pf v diode diode standoff voltage i diode = 10 a 6.0 v i leak diode leakage current (reverse bias) v diode = 3.3 v 100 200 na v sig signal clamp voltage positive clamp negative clamp i load = 10 ma (note 3) 5.6 ? 1.5 6.8 ? 0.8 9.0 ? 0.4 v v esd in ? system esd withstand voltage a) human body model, mil ? std ? 883, method 3015 b) contact discharge per iec 61000 ? 4 ? 2 level 4 (note 2) 30 15 kv r dyn dynamic resistance positive negative 2.30 0.90 f c cut ? off frequency z source = 50 , z load = 50 r = 100 , c = 15 pf 120 mhz 1. t a = 25 c unless otherwise specified. 2. esd applied to input and output pins with respect to gnd, one at a time. 3. clamping voltage is measured at the opposite side of the emi filter to the esd pin. for example, if esd is applied to pin a1, then clamping voltage is measured at pin c1.
cm1420, cm1422 http://onsemi.com 4 performance information typical filter performance (t a = 25 c, dc bias = 0 v, 50 environment) figure 1. insertion loss vs. frequency (a1 ? c1 to gnd b1) figure 2. insertion loss vs. frequency (a2 ? c2 to gnd b1)
cm1420, cm1422 http://onsemi.com 5 performance information (cont?d) typical filter performance (t a = 25 c, dc bias = 0 v, 50 environment) figure 3. insertion loss vs. frequency (a3 ? c3 to gnd b2) figure 4. insertion loss vs. frequency (a4 ? c4 to gnd b2)
cm1420, cm1422 http://onsemi.com 6 performance information (cont?d) typical filter performance (t a = 25 c, dc bias = 0 v, 50 environment) figure 5. insertion loss vs. frequency (a5 ? c5 to gnd b3) figure 6. insertion loss vs. frequency (a6 ? c6 to gnd b3)
cm1420, cm1422 http://onsemi.com 7 performance information (cont?d) typical filter performance (t a = 25 c, dc bias = 0 v, 50 environment) figure 7. insertion loss vs. frequency (a7 ? c7 to gnd b4, cm1422 only) figure 8. insertion loss vs. frequency (a8 ? c8 to gnd b4, cm1422 only)
cm1420, cm1422 http://onsemi.com 8 performance information (cont?d) figure 9. filter capacitance vs. input voltage over temperature (normalized to capacitance at 2.5 vdc and 25 c)
cm1420, cm1422 http://onsemi.com 9 application information table 5. printed circuit board recommendations parameter value pad size on pcb 0.240 mm pad shape round pad definition non ? solder mask defined pads solder mask opening 0.290 mm round solder stencil thickness 0.125 ? 0.150 mm solder stencil aperture opening (laser cut, 5% tapered walls) 0.300 mm round solder flux ratio 50/50 by volume solder paste type no clean pad protective finish osp (entek cu plus 106a) tolerance ? edge to corner ball 50 m solder ball side coplanarity 20 m maximum dwell time above liquidous 60 seconds maximum soldering temperature for lead ? free devices using a lead ? free solder paste 260 c non ? solder mask defined pad 0.240 mm dia. solder stencil opening 0.300 mm dia. solder mask opening 0.290 mm dia. figure 10. recommended non ? solder mask defined pad illustration figure 11. lead ? free (snagcu) solder ball reflow profile 200 250 150 100 50 0 1:00.0 2:00.0 3:00.0 4:00.0 time (minutes) temperature ( c)
cm1420, cm1422 http://onsemi.com 10 package dimensions wlcsp15, 2.96x1.33 case 567bs ? 01 issue o seating plane 0.05 c notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. coplanarity applies to spherical crowns of solder balls. 2x dim a min max 0.56 millimeters a1 d 2.96 bsc e b 0.29 0.35 ed 0.50 bsc 0.65 d e a b pin a1 reference ed a 0.05 b c 0.03 c 0.05 c 15x b 456 c b a 0.05 c a a1 a2 c 0.21 0.27 1.33 bsc ee 0.435 bsc 0.25 15x dimensions: millimeters *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 0.50 0.87 0.44 0.05 c 2x top view side view bottom view note 3 ee a2 0.40 ref recommended a1 package outline 123 789 pitch ed/2
cm1420, cm1422 http://onsemi.com 11 package dimensions wlcsp20, 4.00x1.46 case 567bz ? 01 issue o seating plane 0.05 c notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. coplanarity applies to spherical crowns of solder balls. 2x dim a min max 0.56 millimeters a1 d 4.00 bsc e b 0.29 0.35 ed 0.50 bsc 0.65 d e a b pin a1 reference ed a 0.05 b c 0.03 c 0.05 c 20x b 456 c b a 0.05 c a a1 a2 c 0.21 0.27 1.46 bsc ee 0.435 bsc 0.05 c 2x top view side view bottom view note 3 ee a2 0.40 ref 123 789 10 11 12 0.25 20x dimensions: millimeters *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 0.50 0.87 0.44 recommended a1 package outline pitch ed/2 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5773 ? 3850 cm1420/d optiguard is a trademark of semiconductor components industries, llc (scillc). literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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